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中兴“天机”Grand S II发布 技术领先 - 站长搜索
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中兴“天机”Grand S II发布 技术领先

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2014-04-04 09:57:22 转载来源: 网络整理/侵权必删

中兴“天机”Grand S II发布 技术领先类型:厂商稿 作者:中兴 时间:2014-04-03 11:02:08骁龙801顶级处理器、Qualcomm RF360前端解决方案、五模十七频、1300万像素摄像头……中兴通讯于4月1日发布“天机”Grand S II,众多科技要素闪耀。中兴GRAND S II 配备5.5英寸IPS全高清大屏,一手掌控,且独创最新PowerMO分屏功能,支持用户在一个界面同时开启两个窗口

中兴天机Grand S II发布 技术领先

类型:厂商稿 作者:中兴 时间:2014-04-03 11:02:08

骁龙801顶级处理器、Qualcomm RF360前端解决方案、五模十七频、1300万像素摄像头……中兴通讯于4月1日发布“天机”Grand S II,众多科技要素闪耀。

中兴GRAND S II 配备5.5英寸IPS全高清大屏,一手掌控,且独创最新PowerMO分屏功能,支持用户在一个界面同时开启两个窗口。这款手机还主打智能语音个性化体验,具备低功耗语音唤醒、声纹解锁、高保真通话、语音搜索等功能。

中兴“天机”Grand S II发布 技术领先

在最领先科技方面,骁龙801处理器为中兴Grand S II带来了更加引人入胜的移动用户体验,比如通过更大且更快的摄像头传感器和更好的图像后处理带来更高质的图像、更高性能的移动图形和游戏。骁龙801处理器集成具备先进处理性能的四核Krait 400 CPU和针对高品质图形的Adreno 330 GPU,同时保持行业领先的电池续航性能。在骁龙801处理器中,Qualcomm还对其关键处理引擎的性能进行了提升,包括CPU、GPU、DSP、摄像头传感器和内存组件。骁龙801还集成“全球模”基带处理器,完美支持中兴Grand S II为用户提供“全球通行畅听无阻”的体验。

还有特别值得一提的是,中兴Grand S II也是全球首款采用Qualcomm业界领先的的集成CMOS功率放大器(PA)和天线开关的多模多频段芯片的智能手机。这两款芯片都是Qualcomm RF360前端解决方案的关键组件,这一解决方案能够支持OEM厂商打造用于全球LTE移动网络的单一多模设计。中兴通讯对外合作副总裁兼全球高端技术团队负责人王众博士曾表示,“Qualcomm的射频芯片组具有卓越的性能和效率,让我们能够设计功耗更低且外形更时尚的终端,并能够连接到全球最快的网络上。”MWC期间,Qualcomm RF360获得Telecoms.com的终端创新奖,RF360前端解决方案家族之中的三款芯片组已实现商用。

标签: 中兴 天机 Grand II 发布 技术领先


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