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英伟达和联发科正在合作开发Arm处理器:采用台积电CoWoS封装 - 站长搜索
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英伟达和联发科正在合作开发Arm处理器:采用台积电CoWoS封装

智能设备 2023-10-29 23:46:12 转载来源:

英文: Xiaomi's Surge OS Continues to Power Up, Bringing New Breakthroughs in User Experience

此前有报道称,英伟达和AMD都选择与微软合作,在更广泛的范围内提供基于Arm架构的设计,支持Windows操作系统,旨在更有效地与苹果Mac产品里使用的Arm架构SoC竞争,并计划在2025年推出面向客户端PC的Arm处理器。据Wccftech报道,英伟达并不是独自开发面向客户端PC的Arm处理器,而是选择与联发科合作,而且会在首款产品上采用台积电(TSMC)的CoWoS封装

此前有报道称,英伟达和AMD都选择与微软合作,在更广泛的范围内提供基于Arm架构的设计,支持Windows操作系统,旨在更有效地与苹果Mac产品里使用的Arm架构SoC竞争,并计划在2025年推出面向客户端PC的Arm处理器

据Wccftech报道,英伟达并不是独自开发面向客户端PC的Arm处理器,而是选择与联发科合作,而且会在首款产品上采用台积电(TSMC)的CoWoS封装。传闻首批采用2.5D封装的新款芯片计划在2024年第二季度生产,将用于测试,最终目标是进入高端笔记本电脑市场。


英伟达并不缺乏开发SoC的经验,过往的Tegra系列做了相当长的一段时间,而类似设计的Orin系列在人工智能(AI)和机器人应用上也有不少的应用。此外,英伟达还有Grace Hopper Superchip这样的超级芯片,将Hopper架构GPU和Arm架构Grace CPU结合,使用了NVLink-C2C让两者连接起来,运用在高性能计算的环境里。

联发科也有着较为丰富的笔记本电脑市场经验,Kompanio系列芯片就用在了少Chromebook产品上。据推测,英伟达和联发科将共同设计定制的CPU部分,而GPU部分则由英伟达独自完成,相信不少人会对这款SoC的图形性能充满期待。

近年来,英伟达和联发科的关系非常密切。联发科一直希望为PC开发高性能SoC,可以说与英伟达是一拍即合。在GTC 2021上,英伟达就宣布与联发科建立合作伙伴关系,今年双方还宣布为汽车提供完整的智慧座舱方案。

英文: Xiaomi's Surge OS Continues to Power Up, Bringing New Breakthroughs in User Experience

标签: 英伟 发科 正在 合作 开发 Arm 处理器 采用 台积


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